Principal Mechanical Microelectronics Engineer

Rockwell Collins (


  Full Time   Employee

Cedar Rapids
United States

Principal Mechanical Microelectronics Engineer

At Rockwell Collins, it’s our people who make the difference and are the backbone of our technologies. Employing some of the most talented, dedicated people on the planet is not by chance. People from all over the globe choose Rockwell Collins as the cornerstone of their careers, helping create and deliver communications, integration, and engineering solutions that our global customers demand so that our world keeps moving and stays connected. Join Rockwell Collins and help shape our future while creating yours.

Creating a profile for this requisition will put your resume into consideration for a Principal Mechanical Engineering position within the Government Systems (GS) Microelectronics Packaging Group at Rockwell Collins. This potential opportunity is located in Cedar Rapids, Iowa. A comprehensive relocation package is available to qualified candidates. Upon receiving your profile recruiters and hiring managers will review your resume and profile for further consideration. If your qualifications and job preferences align with one of our available opportunities you will be notified via email regarding the next steps in the application process. If you receive this additional communication, please follow the steps as indicated to be further considered for this opportunity. Your profile will be kept on file for consideration for the next six months.

Mechanical Engineering within the Microelectronics Packaging technology group involves a variety of design and development activities that span the entire product development life cycle of multiple Rockwell Collins products and technologies.

Examples of activities performed in this rapidly growing area, include but are not limited to:

Packaging conceptualization
Technology developments
Preliminary / detailed design
Prototype build & evaluation
Qualification testing, factory transition, and manufacturing support.

Desired Technical Skills/Experience:
Possess good mechanical engineering skills
Desire to design and development state of the art miniaturized electronic devices.
Good written and verbal skills
Willingness to learn and expand own technology base
Work well within a diverse team environment

Required Technical Skills/Experience:
Microelectronics design and manufacturing assembly
Microelectronic packaging materials and material properties
Electronic component reliability testing
Post wafer fabrication processes
Failure analysis techniques
Proficiency in MS Office products

Working knowledge of mechanical 3D CAD and analysis tools such as ANSYS is a plus.

Bachelor's degree in a Science, Technology, Engineering or Math (STEM) discipline.

Applicant must be capable of obtaining a U.S. Department of Defense (DoD) Security Clearance (US Citizenship required).

At Rockwell Collins, we believe a solid work-life balance creates a healthy lifestyle and inspires creativity and innovation. We value our people and invest in their development, growth and success at our company by providing development opportunities through Rockwell Collins University, networking, mentoring, and tuition reimbursement.

And that’s just for starters.

Some of our competitive benefits package includes:
• Medical, dental, and vision insurance
• Three weeks of vacation for newly hired employees
• Company-paid winter holiday shutdown for most locations
• Generous 401(k) plan that matches 62.5 percent of the first 8 percent of eligible compensation you contribute (or 5 percent if you save 8 percent)
• An Incentive Pay Plan based upon company performance
• Tuition reimbursement
• And more

Interested yet? Apply now and embark on your next worthwhile adventure!

Rockwell Collins is an equal opportunity employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, gender, sexual orientation, gender identity, disability, protected veteran status or any other protected status.

**Job:** **Mechanical*

**Organization:** **Communications Engineering*

**Title:** *Principal Mechanical Microelectronics Engineer*

**Location:** *Iowa-Cedar Rapids*

**Requisition ID:** *MIC0000004F*

To apply for this job, contact:
Seth Wear

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