The Mechanical Subsystems Directorate (MSD) is searching for an experienced Electronics Packaging Design Engineer to work in our Tucson, AZ location. In this position, the candidate will be responsible for developing technical solutions to a wide range of complex problems related to the entire product life cycle including proposal, design, manufacture, integration and test of electronics and interconnect packaging solutions for multiple missile programs. The candidate is responsible for supervising the definitions of mechanical outline and construction details, connector selection and specification, mechanical and assembly drawings, oversee electrical layout and be responsible for final technical data package. Familiarity CREO and drawing standards is desired. The candidate will also be responsible for meeting cost, schedule, quality, and performance requirements for the finished product. The candidate will work with minimal direction or supervision, while exercising considerable latitude in determining the technical objectives of the assignment. The position will require frequent interaction with senior external personnel on significant technical matters often requiring coordination between organizations. Periodic travel will be required to CCA, interconnect, machining, and flex circuit manufacturing facilities. International travel may also be required. Mentorship will be expected.
Note: This position is a Salary Grade G10 (Principal Mechanical Engineer)
Required Experience and Skills:
A minimum of eight (8) years of experience in the design and manufacturing of electronics packaging for military and aerospace applications
Must possess a thorough knowledge of GD&T, ANSI drawing standards and first order analysis techniques.
Ability to travel periodically to machine suppliers and CCA manufacturing facilities to support programs.
Must have a working knowledge of Microsoft Office (Word, Excel, PowerPoint)
Must currently have or be able to obtain a DoD Secret Clearance
U.S. Citizenship is required
Desired Experience and Skills:
Ten (10) or more years of experience in the design and test of electronics packaging for military and aerospace applications
Familiarity with CREO(Pro/E) or similar 3D solid modeling software
Cognizant of machine suppliers’ capabilities or have direct experience in a manufacturing and assembly support role
Familiarity with the design and manufacturing processes of CCAs, metal housings, sheet metal
Strong technical background with high technical aptitude
Strong leadership skills and project management skills
Strong desire to mentor earlier career engineers
Very strong verbal and written communications and interpersonal skills when working with team members and customers
Advanced degree in Mechanical or Electrical Engineering
Required Education (Including Major):
Bachelor’s Degree in Mechanical or Electrical Engineering
This position requires the eligibility to obtain a security clearance. Non-US citizens may not be eligible to obtain a security clearance. The Defense Industrial Security Clearance Office (DISCO), an agency of the Department of Defense, handles and adjudicates the security clearance process. Security clearance factors include, but are not limited to, allegiance to the US, foreign influence, foreign preference, criminal conduct, security violations and drug involvement. Employment is contingent on other factors, including, but not limited to, background checks and drug screens.
Raytheon is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, sex, sexual orientation, gender identity, national origin, disability, or protected Veteran status.