The Raytheon Space and Airborne Systems (SAS) Business Unit vision is to partner with customers to deliver affordable systems for today’s challenges and to innovate open mission system solutions for tomorrow’s global security challenges as well. Within Raytheon SAS, the Hardware Engineering Center (HWEC) partners with customers and other Raytheon engineering disciplines and support functions to develop and deliver state-of-the-art hardware solutions to address these challenges.
This Hardware Engineering Center (HWEC) position will perform mechanical design and documentation tasks in the development of Next Generation RF Sensor Hardware and supporting Electronics and Sub-systems. Candidates will be expected to follow established procedures and instructions while working closely with program and functional leadership to ensure that overall design objectives are met. Candidates will be expected to have experience in the use of 3D CAD software (PTC Creo preferred) and have experience in RF electronics packaging or similar mechanical design. Candidate is also expected to be experienced in the use of GD&T for design documentation and fabrication.
Raytheon is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, sex, sexual orientation, gender identity, national origin, disability, or protected Veteran status.