Principal Process Engineer - Military veterans preferred

2018-12-05
Raytheon (www.raytheon.com)
Other

/yr

  full-time   employee


Goleta
California
United States

Process Engineer to support and maintain Infrared Focal Plane Manufacturing. Raytheon Vision systems is a leader in the design and production of Infrared Focal Plane arrays. This position is for a highly skilled, experienced and motivated engineer with a background in flip chip bonding (hybridization). This position is to maintain and develop flip chip bonding processes for high density interconnects using precision alignment flip chip bonding equipment. Raytheon is manufacturing some of the world’s largest Focal Plane Arrays and these products lead to unique requirements in flip chip bonding which will be developed and documented as part of this position. Raytheon Vision Systems is a cross functional organization and the ideal candidate will have a breadth of knowledge in the disciplines of Process Engineering and Process control, Equipment Engineering, Precision Alignment and semiconductor devices. The ability to collaborate across these functions as well as with technicians and other stakeholders is essential. This position will also require leadership and project management skills in running process improvement projects and managing capital acquisitions

Required Skills:

  • 6+ years of professional engineering experience in flip chip bonding, precision assembly, or precision alignment
  • Experience with engineering principles, theories, and concepts
  • Experience in a laboratory environment
  • Experience with mechanical activities and/or chemical handling ability
  • Experience with Excel, Word, PowerPoint
  • Experience developing and delivering presentations (verbal and/or written) to key stakeholders
  • U.S. Citizenship status is required as this position will require the ability to access US only data systems.

Desired Skills:
  • Ability to read, interpret, and create mechanical drawings or schematics
  • 10+ Years’ experience in Focal Plane manufacturing and processing; specifically with FC-150 and FC-300 flip chip bonders
  • Advanced knowledge of engineering principles, theories, and concepts
  • Solid understanding of basic semiconductor physics; interpretation of PV data, specifically wrt flip chip bonding effects
  • Excellent mechanical aptitude and/or chemical handling ability
  • Expert level knowledge of semiconductor processing equipment, methods, and processes
  • Familiarity with a cleanroom work environment (Class 100)
  • Expert level capability with various microscopes and inspection techniques of Flip chip devices
  • Knowledge of Statistical Process Control (SPC)and Design of Experiments (DOE/ANOVA)
  • Machine code programming experience
  • Leadership experience
  • Program and Project management experience

Required Education:
Bachelor of Science Degree in Mechanical Engineering.

Desired Education:
Masters’ Degree in Mechanical Engineering. 128911

Raytheon is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, sex, sexual orientation, gender identity, national origin, disability, or protected Veteran status.