The Antenna & Electronic Subsystems Mechanical Engineering Department is seeking a mechanical engineer to perform electronics packaging design of Airborne Radar Subsystems including Antenna, Receiver, Exciter, Processor and Power units. Tasks will include mechanical engineering throughout the hardware design life cycle, including concept development, detailed design, oversight of production, and installation. Designs will be for tactical airborne defense environment based sensor systems. Typical technologies include high density printed wiring board based systems, electronic enclosures, thermal heat exchangers, machined components and RF subassemblies, adhering to design constrains such as Size, Weight, Power and design to Cost. The candidate will frequently lead small teams through the design development and will be expected to follow established procedures in the creation of technical data packages and design guidelines while working closely with program/functional supervision to ensure the overall design objectives are met. This position will also include performing project level tasks such as tracking budget and schedule performance and supporting design reviews, customer meetings and discussions.
Candidate should possess the desire to grow and perform as a specialized engineer focused on system electronic packaging. The candidate will be required to work from requirements to develop unit design concepts and perform design trades. The candidate will be required to complete detailed layouts and design documentation using Computer Aided Design tools. They will also be required to provide support to suppliers who are fabricating the unit components and assemblies.
B.S. Mechanical Engineering or related engineering field
Raytheon is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, sex, sexual orientation, gender identity, national origin, disability, or protected Veteran status.