Process Engineer to support and maintain Infrared Focal Plane Manufacturing. Raytheon Vision Systems is a leader in the design and production of Infrared Focal Plane arrays. This position is for a highly skilled, experienced and motivated engineer with a background in flip chip bonding (hybridization). This position is to maintain and develop flip chip bonding processes for high density interconnects using precision alignment flip chip bonding equipment. Raytheon is manufacturing some of the world’s largest Focal Plane Arrays and these products lead to unique requirements in flip chip bonding which will be developed and documented as part of this position. Raytheon Vision Systems is a cross functional organization and the ideal candidate will have a breadth of knowledge in the disciplines of Process Engineering and Process control, Equipment Engineering, Precision Alignment and semiconductor devices. The ability to collaborate across these functions as well as with technicians and other stakeholders is essential. This position will also require leadership and project management skills in running process improvement projects and managing capital acquisitions
Raytheon is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, sex, sexual orientation, gender identity, national origin, disability, or protected Veteran status.