Analyst-Principal - Military veterans preferred

Req Id: 166
Job Title: Analyst-Principal
Location:

ARL Maryland - Adelphi, MD 20783 US (Primary)

The Mechanical Engineer will support ARL’s Electromagnetic Effects Branch (EM Effects) under the VIRTUE program. The role focuses on R&D in MEMS, additive manufacturing, electronics packaging, and micro-scale energetics. The candidate will model, fabricate, assemble, and test novel devices using advanced cleanroom processes (lithography, etching, deposition, sputtering, bonding) and contribute to reliability testing under extreme environments.

The candidate will also contribute to reporting, publications, and collaboration with ARL researchers and Fibertek technical staff, providing technical expertise in novel electronics packaging and MEMS-based devices.

ESSENTIAL JOB DUTIES:

• Conduct modeling, simulation, and mask design for MEMS and micro-scale sensor/actuator systems
• Lead process development with novel and established materials, supporting unconventional electronics packaging research.
• Perform hands-on fabrication using MEMS and additive manufacturing techniques (lithography, deposition, etching, bonding).
• Coordinate and execute reliability testing under varied environmental conditions (temperature, humidity, shock, stress).
• Collaborate with ARL researchers, chemists, and engineers to design and package advanced electronic devices.
• Generate reports, technical documentation, and publish findings where appropriate.
• Mentor junior researchers and support laboratory development.

MINIMUM REQUIREMENTS:

• Education: MA/MS in Mechanical Engineering (MEMS specialization)
• Experience: 10+ years in MEMS, energetics, packaging, and microfabrication, with a proven record of patents, publications, and DoD program leadership.
• Clearance: Active Secret (eligible for TS/SCI as required).
• Skills:

1. MEMS and microfabrication processes (lithography, deposition, etching, bonding).
2. Additive manufacturing and 3D micro-printing.
3. Energetic materials and electronics packaging.
4. Mechanical modeling, heat transfer, stress/strain analysis, thin films.
5. Device and materials characterization (SEM, EDX, probe stations).
6. Strong technical writing, communication, and publication record.

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