The Hardware Engineering Center (HWEC) is an engineering organization that focuses on Mechanical product design, producibility, and mission assurance. It is a vital link in the integrated product development process that allows Raytheon Space and Airborne Systems to introduce reliable new products faster, better, and more economically.
Primary job responsibilities is to perform conceptual and detailed mechanical design of High density Electronic packaging designs and Electronic components / devices for application in space applications and airborne defense. Responsibilities include the design of electronic packaging chassis and structures, interconnects, thermal control design of high density electronic systems and electronic enclosures, adhere to design constraints of Size, Weight and Power, design to cost. Candidate will be expected to follow established procedures in creation of technical data package, design guidelines and while working closely with program / functional supervision to ensure the overall design objectives are met. Contacts are primarily with the immediate section manager, team lead, project leaders and other personnel (peers) within the applicable program.
Position is with the Space Systems RF & Communications Electronics Department in El Segundo California.
Bachelor of Science in Mechanical Engineering, or related engineering field, from an accredited university.
Master of Science or Ph.D. in Mechanical Engineering, or related engineering field, from an accredited university.
Raytheon is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, sex, sexual orientation, gender identity, national origin, disability, or protected Veteran status.