The Electrical Subsystems Directorate (ESD), Electro-Optical (EO) Products and Technologies Department is currently searching for a Detector Design Engineer with design and analysis skills, interest and/or experience in infrared systems, detector fabrication, and testing. Chosen team member will work with multi-discipline teams supporting military programs in the development and production phases of infrared sensors. Assignments may include design and analysis of infrared detectors, working closely with component suppliers, troubleshooting EO systems, and providing solutions to a variety of EO problems of moderate scope and complexity. Candidate should be capable of leading small teams and will work closely with Integrated Product Team Leads/Program Managers ensuring engineering requirements are defined, risks are managed and schedules/budgets are met. Candidate will work under limited supervision while exercising responsibility in determining and meeting the technical, financial, and schedule objectives of projects. As a Detector Engineer, decisions are data driven in nature and require preparing technical justification analysis reports as well as presenting to a variety of Engineering and Program Review Boards.
NOTE: This position can be a Sr Systems Engineer I or Sr Systems Engineer II based on the candidate's qualifications as they relate to the skills, experience and responsibility requirements for the position.
Required Technical Skills:
- Minimum course work and related experience design, analysis, fabrication, and test
- Minimum PhD or 4 years of experience
- Research experience fabricating IR detectors
- Research experience with detector characterization
- Ability to obtain Secret Clearance
- Familiarity with testing, modeling and analyzing detectors
Desired Technical Skills: - Performance modeling of infrared systems including: fundamental device physics, radiometric analysis to support acceptance testing, system level performance assessments
- Experience with requirement generation, flow down, verification and validation
- Familiarity with CZT, HgCdTe, III-V nBn, or pBp manufacturing process such has Molecular Beam Epitaxy (MBE) and Liquid Phase Epitaxy (LPE) for single color and multispectral Infrared (IR) Devices
- Experience with Focal Plane Array manufacturing and testing
- Experience with IR device packaging techniques for tactical applications including: optical alignment techniques, vacuum packaging and cryogenic applications
- Experience with Seeker and Sensor Integration and test
- Experience with electronic design for low noise IR applications
- Read Out Integrated Circuit Design Experience
- Experience with cryogenic Infrared Devices, uncooled Infrared Devices, and Visible CCDs preferred
- Prefer experience with Tier II Programs
Required Education:- Bachelor's Degree in Electrical Engineering or Physics
Critical Soft Skills:- Ability to manage multiple priorities
- Strong interpersonal skills working in a team environment
- Group management and leadership skills
- Excellent Written, Verbal, and presentation Skills
- Ability to travel to other facilities in support of program activities
This position requires the ability to obtain and hold a DoD secret security clearance.This position may require the successful issuance, transfer or maintenance of any clearances and/or accesses necessary for the position. Non-US citizens may not be eligible to obtain a security clearance. The Defense Industrial Security Clearance Office (DISCO), an agency of the Department of Defense, handles and adjudicates the security clearance process. Security clearance factors include, but are not limited to, allegiance to the US, foreign influence, foreign preference, criminal conduct, security violations and drug involvement. 147877
Raytheon is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, sex, sexual orientation, gender identity, national origin, disability, or protected Veteran status.