SAS Engineering is seeking an experienced Failure Analysis Engineer to perform root cause failure analysis, in support of all Largo Consolidated Manufacturing Center (CMC) Factory Programs.
Abilities to work with engineers, program and process cell teams on Root Cause, and Corrective Action (RCCA) evaluations with strong communication skills are required. The individual must be familiar with circuit board construction, capable of setting up PWB coupons, perform micro-section and evaluate samples per IPC standards. The candidate should be capable of working with circuit board and component suppliers to resolve process issues. A broad electronic, mechanical and materials background is required to address production related issues, maintain lab equipment and perform analytical tests including but not limited to: Materials/Metallurgical Coatings, Plating, Adhesive, Paint, Printed Wiring Boards, Circuit Card Assemblies, Electrical Components, modules and assemblies.
Must have hands on experience in component decapsulation, DPA micro-section, SEM/EDS operation, familiarity with metallography, radiography, X-ray fluorescence (XRF) tensile & hardness testing. This position also requires the ability to perform shelf life recertification tests on a variety of materials including: Epoxies, adhesives, paint, labels and gaskets.
Raytheon is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, age, color, religion, creed, sex, sexual orientation, gender identity, national origin, disability, or protected Veteran status.